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Nordson Yestech FX-940 3D AOI System
Automated Optical Inspection System
3D Inspection
DOM: 03/2018
Multi-function system with top-down viewing,
Capture on the fly technology
Digital Fringe Projection 3D Inspection
Throughput: Up to 30 sq. in./sec. > 1.5 million components per hour
Maximum Board Size: 20” x 21” (500mm x 525mm)
Clearance: 2” (50mm) top and bottom
Minimum Component Size: 0201; 01005 with high magnification option
False Calls: <500 PPM (<0.05% typical)
Defects Detected: Part: position, missing, wrong, polarity, skew, tombstone
Lead: bent, lifted, bridging
Solder: open, insufficient, short, solder balls
3D Inspection
Proprietary megapixel color imaging
Capture on the fly technology
Quick set-up
High speed
High defect coverage / low false failure
Automated Inspection for:
Solder defects
Lead defects / lifted leads
Component presence and position
Correct part / polarity
Through-hole parts
Co-planarity of chips, BGAs and other height sensitive devices
Power: 110-220VAC, 50/60 Hz, 15 amps
Air input: 60 PSI min., 1/4” air hose, 2 CFM
Footprint: 39” x 52” x 60” (1000mm x 1329mm x 1531mm)
Weight: 1050 lbs (430 kg)