NEW SMEC PL 800GB

High Precision, High rigidity Ceramic and Quartz grinding machine.

Purposely Designed for semi-conductor manufacturing market.

Capacity
Swing Over the Bed 31.5″
Swing Over the Cross
Slide 25.6″ Max.
Grinding Diameter 25.6″
Max. Grinding Length 5.91″

Spindle
Spindle speed 2,200 rpm
Spindle Nose A2-6
Spindle Bore 2.41
Main Spindle motor (Cont./Max) 14.76/20.12

Travel
Axis Travel (X/Z) 15.75″/15.75″
Guide ways Box Guide
Rapid Traverse Rate (X/Z) 944.89/1,181.11 inch/min

Grinding Spindle
Spindle Speed 6,000 rpm
Spindle Motor (cont/max) 3.7/5.5 hp
Tool Shank Type BBT40
Spindle Lubrication and Cooling Grease encapsulation

ATC (Optional)
Max Number of Tools 2 Tool
Change Method Double Arm Swing

General
Floor Space (L×W) 113.75″ x 71.11″
Machine Weight A [B] 7,936 lbs.
Controller Fanuc 0i-TF+