USED KOH YOUNG 2 3D

THE KOH YOUNG ASPIRE 2 3D SOLDER PASTE INSPECTION MACHINE IS A PCB ASSEMBLY SYSTEM DESIGNED FOR FULL 3D PROFILING AND INSPECTION OF SOLDER PASTE DEPOSITS. IT OPERATES ON 220 VAC, SINGLE-PHASE POWER. THE SYSTEM UTILIZES SHADOW-FREE 8-WAY PROJECTION TECHNOLOGY TO MEASURE AND INSPECT CRITICAL SOLDER PASTE ATTRIBUTES INCLUDING VOLUME, AREA, HEIGHT, X/Y OFFSET, BRIDGING, SHAPE DEFORMATION, AND PAD PRESENCE. IT ACCOMMODATES PRINTED CIRCUIT BOARDS RANGING FROM A MINIMUM OF 50 X 50 MM TO A MAXIMUM OF 510 X 510 MM. THE MACHINE PERFORMS 3D MEASUREMENTS WITH A TYPICAL INSPECTION SPEED OF 0.5 SECONDS PER FIELD OF VIEW, SUPPORTED BY HIGH-RESOLUTION IMAGING FOR PRECISE DEFECT DETECTION AND PROCESS CONTROL IN SURFACE MOUNT TECHNOLOGY MANUFACTURING.