USED KOH YOUNG 2 3D

THE KOH YOUNG ASPIRE 2 3D IS A HIGH-PRECISION 3D SOLDER PASTE INSPECTION (SPI) MACHINE DESIGNED FOR PCB ASSEMBLY PROCESSES. IT EMPLOYS TRUE 3D PROFILOMETRY MEASUREMENT TECHNOLOGY TO INSPECT SOLDER PASTE CHARACTERISTICS INCLUDING VOLUME, AREA, HEIGHT, X/Y OFFSET, BRIDGE, AND SHAPE DEFORMATION. THE SYSTEM OFFERS A HEIGHT MEASUREMENT REPEATABILITY OF LESS THAN 1 ΜM (2 SIGMA) AND Z-AXIS RESOLUTION OF 1 ΜM. IT FEATURES AN XY RESOLUTION OF 10X10 ΜM OR 15X15 ΜM, AND CAN INSPECT PCBS RANGING FROM 50X50 MM UP TO 510X510 MM, WITH A MAXIMUM THICKNESS OF 5 MM. POWER REQUIREMENTS ARE 220 VAC, SINGLE-PHASE, 50/60 HZ, AND IT IS SMEMA COMPATIBLE FOR INLINE INTEGRATION.