NEW 2026 Frontier Semiconductor FSM 128

Wafer bow & warp, Film stress (tensile & compressive), Stress hysteresis

Key features:

Non-contact laser scanning — zero sample damage
Room temperature measurement
Wafer size: 25mm to 200mm (standard), 300mm optional
Bow range: ±1mm
Accuracy: sub-micron
Measurement speed: fast single scan
Manual wafer loading

FSM 128C2C (automated version):

Cassette-to-cassette robotic wafer handling
150mm to 300mm wafers
SECS/GEM factory automation integration
High throughput for HVM environments

Applications:

Thin film deposition process control (ALD, CVD, PVD)
CMP stress monitoring
Epitaxial film qualification
Plating stress measurement
Pre/post process bow comparison

Typical customers:

Intel, Samsung, TSMC, Infineon, Imec
University nanofabs
R&D labs

Method: Non-contact laser scanning
Wafer Size: 25mm – 200mm
Bow Range: ±1mm
Accuracy: Sub-micron
Laser: 650nm & 780nm
Temperature: Room temperature
Loading: Manual
Software: Windows 10/11
Control: Manual (no CNC)
Weight: ~50 lbs
Dimensions: ~24"W × 30"D × 18"H