The Mech-El 772 Hybrid Epoxy Die Mounter enables mounting of a wide variety of chips required by complex hybrid circuits without tool change. Chips such as capacitors, diodes, IC’s and LED’s may be assembled without changing setup, tools or dispenser.
MECHEL 772 EPOXY DIE BONDER INCLUDES STEREO OPTICS
FEATURES
Manual “Z” lever control of both tool and dispenser automatically compensates for multi-level bonding.
Positive viewing of dispensed dots permits various amounts of material to be dispensed for different size chips.
Positive mechanical dispensing system produces consistent dots from .005″ to. 100″
