WESTBOND THERMOCOMPRESSION WIRE BONDER
Bonds fine wires in the range of .5 mil (12 microns) to 2 mil (50 microns)
by the popular thermocompression technique. This machine is the
standard in the industry for bonding extremely small geometries
and particularly GASFET devices. Operator has finite control of
the bonding tool down to the last instant of positioning
over the bond targets.
