The MEI 909 ultrasonic wedge bonder is a simple yet very efficient semi-automatic bonder. It is specifically useful for cerdips, side brazed packages and small hybrids. Unique gravity fed/damper controlled bonding arm ensures a uniform impact force. Two bonding levels can be preset. The user only manipulates the workstage and triggers the bond. Simple mechanics make maintenance very easy. The aluminum or gold wire size it uses is .7-3 mil The weight of this machine is 50 lbs and the size is 12″ W X 18″D X 21″H.
JMI can offer full support on these machines when you purchase them here .
