HYBOND 616 ULTRASONIC PEG BONDER
HYBOND’s Model 616 ultrasonic single channel peg bonder has
been designed to perform ultrasonic attachment of insulated or
bare wire/ribbon. Applications include hard disk head stack
assemblies, head gimbal assemblies, microwave and
sensor circuits.
STANDARD FEATURES
Bond level sensor system which stops Z
movement at bonding level and activates bond force/ultrasonics sequence.
Front panel control of bond head search height
which indexes from last bonding level.
Bond head vertical movement controlled by
push button or electrical foot actuation (manual or automatic).
Electrical chassis with modular circuit boards
for control functions to allow simplified
trouble shooting and repair.
HYBOND standard work platform with 4:1
manipulator.
Force system factory adjusted to prevent
variation.
Anti-static equipment enclosure.
